HyPACT

Introduction

European industries depend on electronic systems that must handle extreme performance, high currents, demanding temperatures, and long lifetimes—conditions under which traditional packaging technologies based on solder joints, underfill, and organic adhesives reach their physical limits. HyPACT addresses this gap by developing a new generation of packaging technologies that are inherently robust, scalable, ready for industrial production, and capable of meeting the reliability requirements of automotive, industrial automation, and energy‑transition applications.