Introduction
European industries depend on electronic systems that must handle extreme performance, high currents, demanding temperatures, and long lifetimes—conditions under which traditional packaging technologies based on solder joints, underfill, and organic adhesives reach their physical limits. HyPACT addresses this gap by developing a new generation of packaging technologies that are inherently robust, scalable, ready for industrial production, and capable of meeting the reliability requirements of automotive, industrial automation, and energy‑transition applications.
HyPACT advances fatigue‑free electronic systems by pushing hybrid bonding, robust power packaging, and inspection technologies far beyond the current state of the art. At its core, the project develops multi‑chip(let) hybrid bonding, where dielectric and copper surfaces are directly joined to create quasi‑monolithic 3D stacks. This approach removes solder, eliminates low‑cycle fatigue mechanisms, and enables interconnect densities beyond 10,000/mm² with sub‑10 µm pitch. Building on this foundation, HyPACT expands hybrid bonding to power electronics, including Si, SiC and GaN devices—an area where no established solutions exist today. New pad architectures, optimized dielectric/metal interfaces, and stress‑aware design strategies ensure stable operation under high voltage, high current, and elevated temperature conditions. These methods are validated using novel thermal test chips, advanced stress‑measurement techniques, and FEM‑based design‑for‑reliability models. For module and system integration, HyPACT introduces patterned sintering and high‑temperature organic laminates that support operation above 200 °C. This enables compact, lightweight, and thermally efficient System‑in‑Package solutions that rely on simple air cooling rather than complex liquid systems—crucial for next‑generation electric drivetrains and energy‑infrastructure electronics.
Two demonstrators showcase the outcomes: a high‑density compute module and a heterogeneous power package that integrates memory, logic, sensors, and WBG power devices. Together, the demonstrators prove how hybrid bonding, advanced materials, and intelligent inspection technologies can redefine the performance and reliability of Europe’s future electronics.
Coordinated by ZEISS, the consortium consists of five industry and two academic partners from Austria and Germany. The consortium covers the entire technological value chain from research and development to innovation and industrial production.