Besi

Besi is responsible for the development of new bonding equipment capabilities and processes to support system integration in HyPACT.

Besi Austria GmbH forms part of the larger Dutch group BE Semiconductor Industries, N.V., an international group of companies operating in the assembly and packaging sector of the semiconductor industry. Besi’s main area of expertise is the development of leading-edge high-precision and high-flexibility assembly processes and die-handling equipment for flip-chip and multi-chip substrate and wafer-level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy, with over 25 years’ experience.

Within HyPACT, Besi develops the second generation of its chip‑to‑wafer hybrid bonder. The machine is intended to achieve alignment accuracies of down to 30 nm and, for the first time, meet the hybrid‑bonding process requirements of the European industry. It will enable heterogeneous integration of chiplets manufactured using different technologies for memory, logic, and power electronics, and efficiently and densely combine their materials (silicon, gallium nitride, and silicon carbide).
Through a newly developed, enlarged, and actively stabilized bonder base, as well as improved motion motors and process sequences, faster and more precise placement will be possible. New inspection capabilities will further enhance accuracy and process capability.

Besi is coordinating the work within work package WP 3 for Fabrication Equipment Development and WP 6 for Dissemination and Exploitation.

More information: www.besi.com