Technology

HyPACT advances the next generation of micro‑ and power‑electronic packaging by pushing hybrid bonding, fatigue‑free assembly, and inline metrology beyond today’s state of the art. At its core, the project develops a quasi‑monolithic 3D integration approach where dielectric and copper surfaces are directly welded, eliminating solder joints, underfill, and other fatigue‑prone materials. This enables ultra‑dense chiplet assemblies with interconnect pitches below 10 µm and pad densities exceeding 10,000/mm², targeting memory, logic, sensors, and power devices in a single stack. To expand hybrid bonding into power electronics, HyPACT introduces new pad structures, surface‑conditioning steps, and stress‑optimized designs. These are validated through thermal test chips, FEM‑based reliability simulations, and high‑temperature operation studies addressing Si, SiC, and GaN devices. The goal is to combine high‑current and high‑voltage components into compact, thermally robust die stacks capable of operating beyond 200 °C, reducing the need for liquid cooling in demanding applications. On the assembly level, HyPACT develops patterned sintering technologies for fine‑pitch electrical interconnects and large‑area sintering for high‑TG laminates and ceramic substrates. These processes support high‑reliability system‑in‑package (SiP) modules in automotive, industrial, and energy‑infrastructure environments

Another major ambition of the project is industrialisation. HyPACT builds Besi’s second generation die‑to‑wafer hybrid bonder, targeting 30 nm alignment accuracy, ISO‑2 clean‑air performance, and throughputs up to 3000 UPH, achieved through an actively stabilized machine base, improved motion systems, advanced optics, and new process automation. In parallel, Zeiss develops the world’s first inline wafer‑level 3D X‑ray tomography system, enabling minute‑scale defect detection with AI‑supported reconstruction and automated analysis. This tool bridges the gap between R&D processes and true production‑line monitoring for hybrid bonding.

HyPACT’s innovations are demonstrated through two hardware demonstrators:

• A hybrid‑bonded multi‑chip computation component, integrating high‑density memory and logic dies.
• A heterogeneous smart power package, combining WBG power devices, drivers, control logic, and sensors in a compact, thermally optimized module

Together, these developments establish a scalable, European‑driven technology platform for highly reliable, high‑performance electronic systems in next‑generation mobility, industrial automation, and new‑energy applications.