Ambition

HyPACT aims to establish hybrid bonding and fatigue‑free packaging as the new industrial standard for high‑performance, high‑reliability electronics packages in Europe. The project’s ambition is to overcome the physical limits of today’s solder‑ and adhesive‑based interconnects and replace them with quasi‑monolithic 3D assemblies that deliver unmatched mechanical robustness, thermal stability, and integration density. By pushing hybrid bonding beyond computing applications into the demanding worlds of automotive, industrial automation, and power electronics, HyPACT seeks to enable chiplet architectures that seamlessly combine silicon, SiC, and GaN components within ultra‑compact modules. This requires breakthroughs in surface preparation, pad design, stress management, and thermal behavior—areas where HyPACT aims to set new benchmarks.

Equally ambitious is the project’s focus on industrialisation: HyPACT will create a new generation of European production tools, including a nanometre‑accurate hybrid bonder and the world’s first inline wafer‑level 3D X‑ray tomography system. Together with advanced patterned sintering and high‑temperature packaging technologies, these innovations will form a robust and scalable manufacturing ecosystem ready for rapid adoption by Europe’s semiconductor, mobility, and energy industries.

With these advances, HyPACT strives not only to expand technological frontiers, but to strengthen Europe’s sovereignty in advanced packaging and to establish a sustainable, globally competitive value chain for next‑generation electronics.