
Nanotest develops a new thermal test chip (TTC) which is intended to serve as a cost-effective mock-up chip for process development in HyPACT. The TTC enables reliability assessments and thermal design optimization of hybrid-bonded chiplets through integrated heating elements and temperature sensors that can simulate high-performance components under operating conditions.
Berliner Nanotest und Design GmbH is one of the leading providers of thermal characterization instruments and services in the field of thermal characterization. Nanotest offers engineering services in the areas of thermal characterization, reliability assessment, and non-destructive testing using thermographic imaging techniques. In recent years, the company has expanded its range of services to include the design, development, and implementation of customer-specific thermal test vehicles (TTVs) based on proprietary thermal test chips (TTCs). BNT already offers TTCs with two connection options: solder balls (flip chip) and Cu pillars. HyPACT will enable BNT to supply TTCs with a third connection option using hybrid bonding with excellent thermal coupling, giving BNT a major advantage over its competitors.
Within the framework of HyPACT, Nanotest pursues the following objectives:
Nanotest is work package leader of WP5 (Test & Validation) and is coordinating work for Demonstrator 2 (hybrid power package, packaging / assembly level).
More information on www.nanotest.eu