
Founded 2001 by a buy-out from Siemens Seminconductor, Swissbit is the leading European manufacturer of memory, security and embedded IoT solutions for high-reliability applications. The Swissbit Germany is the largest subsidary of the Swissbit Group with competencies in custom System-in-Package (SiP) and Multi-Chip Modules (MCM) for the integration of various functionalities in one chip-package, as well as assembly and testing to provide easy to integrate and industrial-grade products. The manufacturing facility in Berlin, Germany, for advanced packaging, assembly and test solutions provides a secure supply chain environment. Nowadays mainly working as an IDM, Swissbit plans to set a focus on also providing advanced packaging OSAT services in the near future. Swissbit Germany’s competencies are hardware development from PCB design to electronic devices, system & software development for system on chip or embedded solutions and the leading process- and test development with own equipment manufacturing for memory test.
Swissbit’s main contribution within the HyPACT project lies in exploring new hybrid bonding techniques for high-performance, low-power memory products supplemented by logic and power products with a strong focus on reliability and sustainability. In particular, Swissbit will provide conventionally packaged components, which will be inspected bei Zeiss and compared by Fraunhofer ENAS regarding thermo-mechanical reliability to the hybrid bonded samples. Thereby, a thorough evaluation of the HyPACT project results is ensured. In addition, with its large expertise and know-how in advanced packaging, Swissbit complements the consortium from a production view by providing requirements and feedback.
As work package lead of WP4, Swissbit will coordinate the works of the consortium regarding the integration process development.
More information on www.swissbit.com