Zeiss

ZEISS is responsible for developing high performance and high-resolution 3D tomography inspection functions to support hybrid bonding process development within HyPACT.

Carl Zeiss Semiconductor Manufacturing Technology (SMT) GmbH is a member of the ZEISS group, an international technology corporation operating in the fields of optics and optoelectronics solutions. As a leading-edge equipment supplier to the global semiconductor industry, ZEISS offers a unique product portfolio in lithography optics, photomask solutions and process control systems that are essential for modern chip fabrication. The increasing complexity, introduction of new materials, the creation of even smaller semiconductor structures, and rapid innovation in chiplets, advanced packaging and heterointegration technologies present constant manufacturing challenges. ZEISS empowers chipmakers worldwide to increase yield and to troubleshoot novel manufacturing processes, with versatile semiconductor inspection platforms including cutting-edge 3D tomography-, submicron electron microscopy, x-ray microscopy systems, and powerful AI-assisted metrology and defect analysis software.

Within HyPACT, ZEISS will develop high-performance 3D x-ray inspection solutions that meet the increasing demands of the hybrid bonding manufacturing process. To support HyPACT process development, ZEISS will carry out software-based quality assurance methods to accurately qualify and quantify bonding defects and metrology characteristics in hybrid-bonded die-to-wafer stacks.

In addition to the technical work, ZEISS is responsible for the overall project coordination and for the work package leadership of WP1 (requirements) and WP7 (project management).

More information: www.zeiss.com