Deliverables
Work Package (WP) overview
WP1: Requirements & Specifications
- D1.1: Detailed specification of the process, equipment, and demonstrator targets as well as the tests for their validation (due March ’26)
- D1.2: Detailed project risk analysis and risk mitigation plan (due June ’26)
WP2: Design & Design Methods
- D2.1: Completed sets of design documents for the test structures and demonstrators for the electronics parts (due December ’26)
- D2.2: Complete sets of design documents for the industrial equipment for hybrid‑bonding, sintering, and X‑ray inspection (due December ’26)
WP3: Fabrication Equipment Development
- D3.1: First pilot stage of Hybrid Bonder development is completed, equipment is available for testing (due June ’27)
- D3.2: Pilot developments for 3D X‑ray inspection are completed and available for sample assessments at wafer and component levels (due June ’27)
WP4: Integration Process Development
- D4.1: Hybrid‑bonding process (including pre‑bonding) is developed and optimized; die‑to‑wafer stacks for both Demonstrators are fabricated (due June ’27)
- D4.2: Fabrication processes for the assembly of fatigue‑free components are developed and verified by Hybrid Power Packages (due December ’27)
WP5 : Tests, Validation & Demonstration
- D5.1: Demonstration and documentation of the KPI capabilities of the hybrid bonder and the 3D X‑ray inspection using chips from industrial production (due June ’28)
- D5.2: Demonstration and documentation of the fatigue‑free behaviour and all KPIs of the smart power SiPs fabricated on the new sintering tool (due June ’28)
WP 6: Dissemination, Exploitation & Standardization
- D6.1: Project website and project communication channels are established (due December ’25)
- D6.2: Final dissemination and exploitation plan including continuous communication to standardization bodies (due June ’28)
WP 7: Project Management
- D7.1: Project guidelines and templates (due July ’25)
- D7.2: Annual Review Report 1 (due August ’26)
- D7.3: Annual Review Report 2 (due August ’27)
- D7.4: Annual Review Report 3 (due June ’28)